Suzhou Sail Science & Technology Co., Ltd.

Grinding Wheels Metal-bond,Diamond Grinding Wheel,Circular Saw Blade,Diamond Blades,Hub Dicing Blade, Manufacturer and Supplier - China(CN)

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  • Electroformed  Diamond  Wheels
    Electroformed  Diamond  Wheels

    Description :        Metal bond diamond tools have become an important tool for hard brittle material grinding because of its high strength, good shape, long lifetime and can meet the request of high speed grinding and ultra precisi

  • Best quality latest back grinding diamond wheels for silicon wafer
    Best quality latest back grinding diamond wheels for silicon wafer

    Description : Resin Bond Blade Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different c

  • Grinding wheels(Resin-bond Wheels)
    Grinding wheels(Resin-bond Wheels)

    Description : Resin Bond Blade Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different

  • Back Grinding Wheel for LED
    Back Grinding Wheel for LED

    Description : The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.  Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. &nb

  • Back Grinding Wheel for LED
    Back Grinding Wheel for LED

    Description : The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.  Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. &nb

  • High Quality Diamond Back Grinding Wheel For Silicon Slice Thinning
    High Quality Diamond Back Grinding Wheel For Silicon Slice Thinning

    Description : Advantage: Minimized wafer edge chipping/improved  die strength,Excellent grinding ablity with high feed/Applicable thin wafer   Sail series grinding wheels employ a new porous vitrified bond with excellent swarf r

  • Diamond Milling Grinding Wheel For Optical Glass
    Diamond Milling Grinding Wheel For Optical Glass

    Description : Product Description Diamond back  grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. This kind of grinding wheel devel